Patentseed

We’re happy to see that Dell is working on making laptops cooler, without increasing the bulk.  Patent application 11/933,671 is titled “Gas Assisted Thixotropic Molded Chassis For Cooling A Computer Chassis.”  We’ll try our best to describe this in plain English.  It looks like Dell’s patent application allows them to make the housing portion with a “reinforcing rib including a cylindrical cross-section.”  The rib section is a pathway for water cooling.  So it would appear that Dell is fabricating a housing and cooling passage together.  They form this “in a novel manner in that the gas assist molding process has not been used with the thixotropic molding process. This is because the thixotropic magnesium molding has less of an issue with cosmetic sink that plastic injection molding, which commonly is used with a gas assist.”  And the thixotropic magnesium is not chilled, thus can be expelled from the housing portion resulting in the formation of the elongated passageway.  Got that?